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2SA1175 - NEC

Description: PNP Silicon Transistor

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PCB Footprints
2SA1175 - NEC PCB footprint - Other - Other - 2SA1175-2
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2SA1175 - NEC  - 3D model - Other - 2SA1175-2
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2SA1175 Details

  • Manufacturer Part Number:

    2SA1175

  • Part Life Cycle Code:

    Obsolete

  • Reach Compliance Code:

    Unknown

  • ECCN Code:

    EAR99

  • Manufacturer:

    NEC Electronics America Inc

  • YTEOL:

    0

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Base Capacitance-Max:

    6 pF

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    110

  • JESD-30 Code:

    R-PSIP-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Polarity/Channel Type:

    PNP

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    180 MHz

  • VCEsat-Max:

    0.3 V

2SA1175 Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) for the 2SA1175 is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal resistance, maximum junction temperature, and voltage and current ratings. As a general rule, it's recommended to operate the device within the specified voltage and current limits to ensure safe operation.
  • To ensure the 2SA1175 is properly biased for linear operation, you should follow the recommended biasing conditions outlined in the datasheet, including the base-emitter voltage (VBE) and collector-emitter voltage (VCE). Additionally, you should ensure that the device is operated within the specified current and voltage ranges, and that the load impedance is matched to the device's output impedance.
  • The recommended PCB layout and thermal management for the 2SA1175 involve using a thermally conductive PCB material, placing the device on a heat sink or thermal pad, and ensuring good airflow around the device. You should also minimize the thermal resistance between the device and the heat sink or thermal pad, and ensure that the device is not exposed to excessive temperatures or thermal stress.
  • While the 2SA1175 is primarily designed for linear applications, it can be used in switching applications with proper design considerations. However, you should be aware of the device's switching characteristics, such as its turn-on and turn-off times, and ensure that the device is not subjected to excessive voltage or current stress during switching transitions.
  • To handle ESD protection for the 2SA1175, you should follow standard ESD protection practices, such as using ESD-sensitive handling procedures, storing the devices in anti-static packaging, and incorporating ESD protection devices or circuits in your design. You should also ensure that the device is not exposed to excessive electrostatic discharge during handling or operation.

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