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2SAR552P5T100 - ROHM Semiconductor

Description: PNP, SOT-89, -30V -3A, Medium Power Transistor

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2SAR552P5T100 - ROHM Semiconductor - PCB symbol
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PCB Footprints
2SAR552P5T100 - ROHM Semiconductor PCB footprint - Other - Other - MPT3
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2SAR552P5T100 - ROHM Semiconductor - 3D model - Other - MPT3
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2SAR552P5T100 Details

  • Manufacturer Part Number:

    2SAR552P5T100

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-62, SOT-89, 3 PIN

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    13 Weeks

  • Date Of Intro:

    2016-04-06

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    8

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    3 A

  • Collector-Base Capacitance-Max:

    25 pF

  • Collector-Emitter Voltage-Max:

    30 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    200

  • JESD-30 Code:

    R-PSSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    2 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    330 MHz

  • VCEsat-Max:

    0.4 V

2SAR552P5T100 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area on the top and bottom layers connected to the thermal pad, and to use thermal vias to dissipate heat. A minimum of 2oz copper thickness is recommended.
  • To ensure proper soldering, use a soldering iron with a temperature of 350°C to 370°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the time the iron is in contact with the device.
  • The recommended storage condition for the device is in a dry, cool place with a temperature range of 5°C to 30°C and humidity below 60%. The device should be stored in its original packaging or in a shielded bag to prevent electrostatic discharge.
  • Yes, the 2SAR552P5T100 is a high-reliability device that meets the requirements of AEC-Q101, making it suitable for use in automotive and other high-reliability applications.
  • To prevent ESD, handle the device in an ESD-protected environment, wear an ESD wrist strap or use an ESD mat, and use ESD-protected packaging and storage materials.

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2SAR552P5T100 Overview

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