ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
To ensure stability, it's essential to follow the recommended capacitor values and types for input and output capacitors, as specified in the datasheet. Additionally, the PCB layout should minimize parasitic inductance and resistance.
The maximum allowed input voltage ripple is not explicitly stated in the datasheet. However, as a general guideline, it's recommended to keep the input voltage ripple below 1% of the input voltage to ensure stable operation.
The 2SAR554PHZGT100 is rated for operation up to 125°C. However, the maximum junction temperature (Tj) should not exceed 150°C. Ensure proper thermal design and heat dissipation to prevent overheating.
Power dissipation (PD) can be calculated using the formula: PD = (Vin - Vout) x Iout + (Vin x Iq), where Vin is the input voltage, Vout is the output voltage, Iout is the output current, and Iq is the quiescent current.
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2SAR554PHZGT100 Overview
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