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2SB1707TL - ROHM Semiconductor

Description: PNP, SOT-346T, -12V -4A, Low VCE(sat) Transistor

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PCB Footprints
2SB1707TL - ROHM Semiconductor PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - TSMT3
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3D Models
2SB1707TL - ROHM Semiconductor  - 3D model - SOT23 (3-Pin) - TSMT3
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2SB1707TL Details

  • Manufacturer Part Number:

    2SB1707TL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-96

  • Package Description:

    TSMT3, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7

  • Collector Current-Max (IC):

    4 A

  • Collector-Emitter Voltage-Max:

    12 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    270

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    0.5 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    250 MHz

2SB1707TL Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the 2SB1707TL is -40°C to 150°C, as specified in the datasheet. However, it's essential to note that the device's performance and reliability may degrade if operated outside this range for extended periods.
  • To ensure proper biasing, follow the recommended voltage and current ratings specified in the datasheet. Additionally, consider the device's input and output impedance, as well as the load conditions, to ensure stable operation. It's also crucial to provide adequate heat sinking to prevent thermal runaway.
  • When selecting a heat sink for the 2SB1707TL, consider the device's power dissipation, thermal resistance, and maximum junction temperature. Ensure the heat sink's thermal resistance is low enough to keep the junction temperature within the recommended range. Additionally, consider the heat sink's size, material, and mounting method to ensure effective heat transfer.
  • To protect the 2SB1707TL from ESD, follow proper handling and storage procedures, such as using anti-static wrist straps, mats, and packaging materials. Ensure that the device is properly grounded during assembly and testing, and consider using ESD protection devices, such as TVS diodes, in the circuit design.
  • The 2SB1707TL's reliability and lifespan are dependent on various factors, including operating conditions, temperature, and quality of the device. ROHM Semiconductor provides reliability data and guidelines in the datasheet and application notes. However, it's essential to perform thorough testing and validation to ensure the device meets the specific application requirements.

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2SB1707TL Overview

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