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2SB1709TL - ROHM Semiconductor

Description: PNP, SOT-346T, -12V -1.5A, Low VCE(sat) Transistor

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PCB Footprints
2SB1709TL - ROHM Semiconductor PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - TSMT3_2021
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3D Models
2SB1709TL - ROHM Semiconductor  - 3D model - SOT23 (3-Pin) - TSMT3_2021
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2SB1709TL Details

  • Manufacturer Part Number:

    2SB1709TL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-96

  • Package Description:

    TSMT3, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7

  • Collector Current-Max (IC):

    1.5 A

  • Collector-Emitter Voltage-Max:

    12 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    270

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    0.5 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    400 MHz

2SB1709TL Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the 2SB1709TL is -40°C to 150°C, as specified in the datasheet. However, it's essential to note that the device's performance and reliability may degrade if operated outside this range for extended periods.
  • To ensure proper biasing, follow the recommended voltage and current ratings specified in the datasheet. Additionally, consider the device's input and output impedance, and ensure that the surrounding circuitry is designed to provide a stable voltage supply and minimal noise interference.
  • When designing the PCB layout, ensure that the 2SB1709TL is placed in a thermally efficient location, with adequate heat dissipation paths. Keep the device away from high-current paths and noise sources, and use a solid ground plane to minimize electromagnetic interference (EMI).
  • The 2SB1709TL has a high power dissipation capability, but it still requires proper thermal management. Use a heat sink or thermal pad to dissipate heat, and ensure good airflow around the device. Consider using thermal interface materials (TIMs) to improve heat transfer between the device and heat sink.
  • The 2SB1709TL is designed to provide high reliability and a long lifespan. However, its actual lifespan depends on various factors, such as operating conditions, temperature, and usage patterns. ROHM Semiconductor provides reliability data and guidelines in the datasheet and application notes, which should be consulted for specific information.

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2SB1709TL Overview

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