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2SC6026MFVGR,L3F - Toshiba

Description: Bipolar (BJT) Transistor NPN 50 V 150 mA 60MHz 150 mW Surface Mount VESM

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Symbol
2SC6026MFVGR,L3F - Toshiba - PCB symbol
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PCB Footprints
2SC6026MFVGR,L3F - Toshiba PCB footprint - Other - Other - 2-1L1A-2025
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3D Models
2SC6026MFVGR,L3F - Toshiba - 3D model - Other - 2-1L1A-2025
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2SC6026MFVGR,L3F Details

  • Manufacturer Part Number:

    2SC6026MFVGR,L3F

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.15 A

  • Collector-Base Capacitance-Max:

    3 pF

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    200

  • JESD-30 Code:

    R-PDSO-F3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.15 W

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    60 MHz

  • VCEsat-Max:

    0.25 V

2SC6026MFVGR,L3F Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the 2SC6026MFVGR,L3F is -40°C to 150°C.
  • To ensure reliability, it is recommended to follow the derating guidelines provided in the datasheet, and to consider using a heat sink or thermal management system to keep the junction temperature within the recommended range.
  • The maximum allowable power dissipation for the 2SC6026MFVGR,L3F is 2.5W, but this can vary depending on the specific application and operating conditions.
  • To prevent ESD damage, it is recommended to follow proper handling and storage procedures, such as using anti-static bags or trays, and to implement ESD protection circuits in the design.
  • The recommended soldering conditions for the 2SC6026MFVGR,L3F are a peak temperature of 260°C, with a soldering time of 10 seconds or less.

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2SC6026MFVGR,L3F Overview

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