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2SCR562F3TR - ROHM Semiconductor

Description: NPN, DFN2020-3S, 30V 6A, Driver Transistor

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Symbol
2SCR562F3TR - ROHM Semiconductor - PCB symbol
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PCB Footprints
2SCR562F3TR - ROHM Semiconductor PCB footprint - Other - Other - HUML2020L3_Master
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3D Models
2SCR562F3TR - ROHM Semiconductor - 3D model - Other - HUML2020L3_Master
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2SCR562F3TR Details

  • Manufacturer Part Number:

    2SCR562F3TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, HUML2020L3, 3 PIN

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    8

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    6 A

  • Collector-Emitter Voltage-Max:

    30 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    200

  • JESD-30 Code:

    R-PDSO-N3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    270 MHz

2SCR562F3TR Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended temperature range (up to 150°C). Use a heat sink or thermal interface material to reduce thermal resistance. Also, consider derating the device's power dissipation at high temperatures.
  • The 2SCR562F3TR can withstand a maximum voltage stress of 1.5 times the rated voltage (Vr) for a short duration (less than 1 second). However, it's recommended to operate the device within the rated voltage to ensure reliable operation.
  • Handle the device with ESD-protective equipment, such as wrist straps or mats. Ensure that the PCB is designed with ESD protection in mind, including TVS diodes or ESD-protection circuits.
  • Store the device in a dry, cool place (less than 30°C and 60% RH) away from direct sunlight. Avoid storing the device in areas with high humidity or near sources of radiation.

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2SCR562F3TR Overview

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