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5962-7802003MEA - Texas Instruments

Description: RS-422 Interface IC 5962-7802003MEA, RS-422/423 QUAD DIFF

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5962-7802003MEA - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - J(R-GDIP-T16)
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5962-7802003MEA Details

  • Manufacturer Part Number:

    5962-7802003MEA

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    16

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Level Input Current-Max:

    0.000002 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-422-B; TIA-422-B; EIA-423-B; TIA-423-B; V.10; V.11

  • JESD-30 Code:

    R-GDIP-T16

  • JESD-609 Code:

    e0

  • Length:

    19.56 mm

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Out Swing-Min:

    2.05 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.008 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Qualified

  • Receive Delay-Max:

    35 ns

  • Receiver Number of Bits:

    4

  • Screening Level:

    MIL-STD-883

  • Seated Height-Max:

    5.08 mm

  • Supply Current-Max:

    70 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

5962-7802003MEA Frequently Asked Questions (FAQs)

  • A good layout should prioritize thermal dissipation by keeping the device away from heat sources, using thermal vias, and ensuring good airflow. Consult TI's thermal management guidelines for more information.
  • Follow TI's EMC guidelines, use proper shielding, and ensure the device is placed at least 1 cm away from other components to minimize electromagnetic interference.
  • TI recommends using a soldering profile with a peak temperature of 240°C, a dwell time of 30-60 seconds, and a cooling rate of 4°C/s to minimize thermal stress.
  • Yes, the 5962-7802003MEA is a radiation-hardened device, making it suitable for high-reliability and aerospace applications. However, consult TI's documentation and relevant industry standards for specific requirements.
  • Consult TI's troubleshooting guides, check for proper power supply and decoupling, and verify signal integrity. If issues persist, contact TI's support team for further assistance.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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