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5962-8754601PA - Texas Instruments

Description: RS-422 Interface IC Not available Through Mouser

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5962-8754601PA - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - NAB0008A
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5962-8754601PA - Texas Instruments  - 3D model - Ceramic Dual-In-Line Packages - NAB0008A
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5962-8754601PA Details

  • Manufacturer Part Number:

    5962-8754601PA

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    2

  • High Level Input Current-Max:

    0.00002 A

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-422

  • JESD-30 Code:

    R-GDIP-T8

  • JESD-609 Code:

    e0

  • Length:

    10.29 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Out Swing-Min:

    2 V

  • Output Low Current-Max:

    0.00005 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Qualified

  • Screening Level:

    MIL-STD-883

  • Seated Height-Max:

    5.08 mm

  • Supply Current-Max:

    65 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Transmit Delay-Max:

    20 ns

  • Width:

    7.62 mm

5962-8754601PA Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout and thermal management guide in their application notes (e.g., SLUA271) and design guides (e.g., TIDA-00628). It's essential to follow these guidelines to ensure optimal performance, reduce thermal issues, and prevent damage to the device.
  • The 5962-8754601PA can deliver high currents, so it's crucial to ensure proper PCB design, component selection, and thermal management. Use thick copper traces, adequate power planes, and suitable bypass capacitors to handle the high current output. Additionally, consider using a heat sink or thermal interface material to dissipate heat.
  • Operating the 5962-8754601PA at high temperatures can reduce its lifespan, increase thermal resistance, and affect its overall performance. Ensure proper thermal management, and consider derating the device's output current and voltage according to the temperature derating curves provided in the datasheet.
  • Implement overvoltage protection (OVP), undervoltage protection (UVP), and overcurrent protection (OCP) circuits to safeguard the device. You can use external components, such as voltage supervisors, current sense resistors, and protection ICs, or integrate these features into your design using Texas Instruments' protection devices (e.g., TPS2660).
  • To minimize electromagnetic interference (EMI) and ensure electromagnetic compatibility (EMC), follow proper PCB design practices, such as using a solid ground plane, minimizing loop areas, and using shielding or filtering components. Additionally, consider using EMI filters, common-mode chokes, or ferrite beads to reduce emissions and improve immunity.

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5962-8754601PA Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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