5962-9321401MEA footprint, schematic symbol and 3D model by Analog Devices

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PCB Footprints

5962-9321401MEA - Analog Devices PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - Q-16_2023

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Part Number 5962-9321401MEA
Manufacturer Analog Devices
Pin Count 16
Part Category Integrated Circuit
Package Category Ceramic Dual-In-Line Packages
Footprint Name Ceramic Dual-In-Line Packages - Q-16_2023
Released Date May 16, 2022
Last Modified Date Feb 19, 2024 6:25 AM UTC
Pinout / Pin List Click Here (Member Only)

5962-9321401MEA Details

Manufacturer Part Number:
5962-9321401MEA
Brand Name:
Analog Devices Inc
Pbfree Code:
No
Part Life Cycle Code:
Active
Part Package Code:
DIP
Package Description:
0.300 INCH, CERDIP-16
Pin Count:
16
Manufacturer Package Code:
Q-16
Country Of Origin:
Philippines
ECCN Code:
EAR99
HTS Code:
8542.39.00.01
Manufacturer:
Analog Devices Inc
YTEOL:
10
Analog IC - Other Type:
THREE TERMINAL VOLTAGE REFERENCE
JESD-30 Code:
R-GDIP-T16
JESD-609 Code:
e0
Neg Supply Voltage-Max (Vsup):
-18 V
Neg Supply Voltage-Min (Vsup):
-13.5 V
Number of Functions:
1
Number of Outputs:
2
Number of Terminals:
16
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-55 °C
Output Voltage-Max:
10.005 V
Output Voltage-Min:
9.995 V
Output Voltage-Nom:
10 V
Package Body Material:
CERAMIC, GLASS-SEALED
Package Code:
DIP
Package Equivalence Code:
DIP16,.3
Package Shape:
RECTANGULAR
Package Style:
IN-LINE
Qualification Status:
Qualified
Screening Level:
MIL-STD-883
Supply Current-Max (Isup):
12 mA
Supply Voltage-Max (Vsup):
18 V
Supply Voltage-Min (Vsup):
13.5 V
Supply Voltage-Nom (Vsup):
15 V
Surface Mount:
NO
Technology:
BIPOLAR
Temp Coef of Voltage-Max:
6 ppm/°C
Temperature Grade:
MILITARY
Terminal Finish:
Tin/Lead (Sn63Pb37)
Terminal Form:
THROUGH-HOLE
Terminal Pitch:
2.54 mm
Terminal Position:
DUAL
Trim/Adjustable Output:
NO

5962-9321401MEA Frequently Asked Questions (FAQs)

For optimal performance, it's recommended to follow Analog Devices' guidelines for PCB layout and thermal management. This includes using a multi-layer PCB with a solid ground plane, placing the device near a heat sink or thermal pad, and ensuring good airflow around the device.
To ensure EMC and reduce EMI, follow proper PCB design and layout practices, such as using shielding, filtering, and grounding techniques. Additionally, consider using EMI-absorbing materials and following Analog Devices' guidelines for EMI reduction.
The 5962-9321401MEA is a high-reliability device with a failure rate that meets or exceeds industry standards. Refer to Analog Devices' reliability reports and failure rate data for more information.
The 5962-9321401MEA is designed to operate in radiation-intensive environments. Refer to Analog Devices' radiation hardness specifications and total ionizing dose (TID) ratings for more information.
Follow proper storage and handling procedures, such as storing the device in a cool, dry place, avoiding physical damage, and using anti-static packaging and handling materials.

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5962-9321401MEA Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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