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5AGXMA3D4F31I3G - Intel

Description: IC FPGA 416 I/O 896FBGA

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5AGXMA3D4F31I3G - Intel PCB footprint - BGA - BGA - 896-Pin FineLine Ball-Grid Array (FBGA)_2021_1
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3D Models
5AGXMA3D4F31I3G - Intel  - 3D model - BGA - 896-Pin FineLine Ball-Grid Array (FBGA)_2021_1
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5AGXMA3D4F31I3G Details

  • Manufacturer Part Number:

    5AGXMA3D4F31I3G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-896

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • JESD-30 Code:

    S-PBGA-B896

  • Length:

    31 mm

  • Number of CLBs:

    5890

  • Number of Inputs:

    416

  • Number of Logic Cells:

    156000

  • Number of Outputs:

    416

  • Number of Terminals:

    896

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    5890 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HBGA

  • Package Equivalence Code:

    BGA896,30X30,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, HEAT SINK/SLUG

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2.7 mm

  • Supply Voltage-Max:

    1.18 V

  • Supply Voltage-Min:

    1.12 V

  • Supply Voltage-Nom:

    1.15 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    31 mm

5AGXMA3D4F31I3G Frequently Asked Questions (FAQs)

  • Intel provides a PCB design guide for the 5AGXMA3D4F31I3G, which recommends a 4-6 layer stackup with a minimum of 2 mil trace width and 2 mil spacing. Additionally, it suggests using a solid ground plane and a 50-ohm impedance-controlled routing for high-speed signals.
  • To optimize power consumption, Intel recommends using the PowerPlay power management technology, which allows for dynamic voltage and frequency scaling. For thermal management, a heat sink with a thermal interface material (TIM) is recommended, and the FPGA's thermal design power (TDP) should be considered when designing the system's thermal management strategy.
  • The 5AGXMA3D4F31I3G's high-speed transceivers have limitations on the maximum data rate, cable length, and signal integrity. Engineers should consider these limitations when designing their system, and Intel provides guidelines for transceiver configuration, signal conditioning, and channel equalization to ensure reliable data transmission.
  • To ensure reliable configuration and boot-up, Intel recommends using a robust configuration scheme, such as the Quad-SPI flash interface, and implementing a power-on reset (POR) circuit to ensure a clean power-up sequence. Additionally, engineers should follow Intel's guidelines for configuration file generation and validation.
  • The 5AGXMA3D4F31I3G has built-in security features, such as the Secure Device Manager (SDM) and the Advanced Encryption Standard (AES) engine. Engineers should consider implementing secure boot mechanisms, encrypting configuration files, and using secure communication protocols to protect their system from unauthorized access and data breaches.

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5AGXMA3D4F31I3G Overview

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