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5CEBA2U15C8N - Intel

Description: Altera 5CEBA2U15C8N, FPGA Field Programmable Gate Array Cyclone V 25000 Cells, 25000 Gates, 2002944, 9434 Blocks,

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PCB Footprints
5CEBA2U15C8N - Intel PCB footprint - BGA - BGA - 324-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.50
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3D Models
5CEBA2U15C8N - Intel  - 3D model - BGA - 324-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.50
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5CEBA2U15C8N Details

  • Manufacturer Part Number:

    5CEBA2U15C8N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, UBGA-324

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B324

  • Length:

    15 mm

  • Number of Inputs:

    176

  • Number of Logic Cells:

    25000

  • Number of Outputs:

    176

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    85 °C

  • Organization:

    943 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA324,18X18,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    15 mm

5CEBA2U15C8N Frequently Asked Questions (FAQs)

  • Intel recommends following the PCB design guidelines outlined in the Intel FPGA PCB Design Guidelines document, which provides detailed information on layout, routing, and signal integrity considerations.
  • To optimize power consumption, use the Intel Quartus Prime Power Analyzer tool to identify power-hungry components and optimize clock frequencies, voltage, and current. Additionally, consider using power-saving features like clock gating and dynamic voltage and frequency scaling.
  • Ensure good airflow around the FPGA, use a heat sink or thermal interface material, and consider using a fan or heat pipe to dissipate heat. Intel recommends following the thermal management guidelines outlined in the Intel FPGA Thermal Management document.
  • Implement a secure boot mechanism using Intel's Boot Loader Development Kit (BLDK) and follow the guidelines outlined in the Intel FPGA Secure Boot document. This ensures the authenticity and integrity of the FPGA configuration data.
  • Follow the EMI and EMC guidelines outlined in the Intel FPGA EMI and EMC document, which provides recommendations for PCB design, component selection, and shielding to minimize EMI and ensure EMC compliance.

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5CEBA2U15C8N Overview

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