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5CEBA2U15I7N - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Cyclone V E 9434 LABS 176 IOs

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PCB Footprints
5CEBA2U15I7N - Intel PCB footprint - BGA - BGA - 324-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.50
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3D Models
5CEBA2U15I7N - Intel  - 3D model - BGA - 324-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.50
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5CEBA2U15I7N Details

  • Manufacturer Part Number:

    5CEBA2U15I7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, UBGA-324

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B324

  • Length:

    15 mm

  • Number of Inputs:

    176

  • Number of Logic Cells:

    25000

  • Number of Outputs:

    176

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    943 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA324,18X18,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    15 mm

5CEBA2U15I7N Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 5CEBA2U15I7N is -40°C to 100°C.
  • Intel recommends using an external POR circuit with a voltage supervisor IC, such as the MAX809, to ensure a reliable power-on reset.
  • Intel provides a PCB layout and routing guide in the Cyclone V Device Handbook, which includes recommendations for signal integrity, power distribution, and thermal management.
  • To optimize timing closure, use the Intel Quartus Prime software to analyze and optimize the design's timing constraints, and consider using the 'TimeQuest' timing analyzer tool.
  • Intel recommends using 0.1 μF to 1.0 μF decoupling capacitors, placed as close as possible to the FPGA's power pins, to minimize power noise and ensure reliable operation.

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