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5CEBA4F17A7N - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Cyclone V E 1848 LABS 128 IOs

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5CEBA4F17A7N - Intel - PCB symbol
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PCB Footprints
5CEBA4F17A7N - Intel PCB footprint - BGA - BGA - 256-FBGA (17x17)
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3D Models
5CEBA4F17A7N - Intel - 3D model - BGA - 256-FBGA (17x17)
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5CEBA4F17A7N Details

  • Manufacturer Part Number:

    5CEBA4F17A7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, FBGA-256

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B256

  • Length:

    17 mm

  • Number of Inputs:

    128

  • Number of Logic Cells:

    49000

  • Number of Outputs:

    128

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1848 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

5CEBA4F17A7N Frequently Asked Questions (FAQs)

  • Intel recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended for optimal thermal performance.
  • Intel recommends a power-up sequence of VCCIO, then VCCA, and finally VCCPD. A minimum delay of 10 ms is recommended between each power-up stage to ensure proper device operation.
  • The maximum operating frequency for the 5CEBA4F17AN is 200 MHz. However, the actual operating frequency may vary depending on the specific application and system design.
  • The 5CEBA4F17AN supports JTAG debugging through the IEEE 1149.1 standard. A JTAG interface is required to connect to the device's TDI, TDO, TCK, and TMS pins.
  • Intel recommends using 0.1 μF and 10 μF decoupling capacitors for VCCIO, VCCA, and VCCPD power rails. The capacitors should be placed as close as possible to the device's power pins.

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5CEBA4F17A7N Overview

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Part Image 5CEBA4F17A7N Altera Corporation

Field Programmable Gate Array, PBGA256