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5CEBA4U19C8N - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Cyclone V E 1848 LABs 224 IOs

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5CEBA4U19C8N - Intel - PCB symbol
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PCB Footprints
5CEBA4U19C8N - Intel PCB footprint - BGA - BGA - 484-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.90
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3D Models
5CEBA4U19C8N - Intel - 3D model - BGA - 484-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.90
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5CEBA4U19C8N Details

  • Manufacturer Part Number:

    5CEBA4U19C8N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, UBGA-484

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B484

  • Length:

    19 mm

  • Number of Inputs:

    224

  • Number of Logic Cells:

    49000

  • Number of Outputs:

    224

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Organization:

    1848 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA484,22X22,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.9 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    19 mm

5CEBA4U19C8N Frequently Asked Questions (FAQs)

  • Intel recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended for optimal thermal performance.
  • Intel recommends a power-up sequence of VCCIO, then VCC, and finally VREF. A minimum delay of 10 ms is recommended between each power-up stage to ensure proper device operation.
  • Intel recommends limiting power rail overshoot to 10% of the nominal voltage to prevent device damage. Exceeding this limit may cause permanent damage to the device.
  • Intel recommends using synchronizers or FIFOs to handle clock domain crossing. Additionally, ensure that clock frequencies are within the recommended specifications to prevent metastability issues.
  • Intel recommends using a configuration device, such as an external flash or a microcontroller, to configure the 5CEBA4U19C8N during power-up. This ensures that the device is properly configured before entering user mode.

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5CEBA4U19C8N Overview

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