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5CEBA9F23C7N - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Cyclone V E 11356 LABs 224 IOs

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5CEBA9F23C7N - Intel - PCB symbol
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PCB Footprints
5CEBA9F23C7N - Intel PCB footprint - BGA - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CEBA9F23C7N - Intel - 3D model - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CEBA9F23C7N Details

  • Manufacturer Part Number:

    5CEBA9F23C7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, FBGA-484

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B484

  • Length:

    23 mm

  • Number of Inputs:

    224

  • Number of Logic Cells:

    301000

  • Number of Outputs:

    224

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Organization:

    11356 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

5CEBA9F23C7N Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 5CEBA9F23C7N is -40°C to 100°C.
  • A reliable POR circuit can be implemented using a voltage supervisor IC, such as the TLV7031, which can detect power-on and power-down events and generate a reset signal for the FPGA.
  • Intel recommends following the PCB layout and routing guidelines outlined in the Intel FPGA PCB Design Guidelines document, which includes guidelines for signal integrity, power distribution, and thermal management.
  • To optimize timing closure, use the Intel Quartus Prime software to analyze and optimize the design's timing constraints, and consider using techniques such as pipelining, retiming, and clock domain crossing to improve timing performance.
  • Intel recommends using decoupling capacitors with values ranging from 0.01 μF to 10 μF, placed as close as possible to the FPGA's power pins, to reduce power supply noise and improve system reliability.

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5CEBA9F23C7N Overview

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Part Image 5CEBA9F23C7N Altera Corporation

Field Programmable Gate Array, PBGA484