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5CEFA4F23I7N - Intel

Description: FPGA Cyclone® V E Family 49000 Cells 28nm Technology 1.1V 484-Pin FBGA

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5CEFA4F23I7N - Intel PCB footprint - BGA - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00----
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3D Models
5CEFA4F23I7N - Intel  - 3D model - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00----
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5CEFA4F23I7N Details

  • Manufacturer Part Number:

    5CEFA4F23I7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, FBGA-484

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B484

  • Length:

    23 mm

  • Number of Inputs:

    304

  • Number of Logic Cells:

    48000

  • Number of Outputs:

    304

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1848 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

5CEFA4F23I7N Frequently Asked Questions (FAQs)

  • The maximum operating temperature of the 5CEFA4F23I7N is typically specified in the datasheet, but if not, it's usually around 85°C for commercial-grade parts.
  • The power sequencing requirements for the 5CEFA4F23I7N should be specified in the datasheet. If not, it's recommended to follow the recommended power-up and power-down sequences to prevent damage to the device.
  • The recommended PCB layout for the 5CEFA4F23I7N should be specified in the datasheet or in a separate application note. If not, it's recommended to follow general PCB design guidelines for high-speed digital circuits.
  • To troubleshoot issues with the 5CEFA4F23I7N, start by reviewing the datasheet and application notes, then check the power supply, clock signals, and data lines for any issues. Use oscilloscopes and logic analyzers to debug the signals.
  • The thermal management considerations for the 5CEFA4F23I7N should be specified in the datasheet. If not, it's recommended to follow general guidelines for thermal management of high-power devices, including heat sinks, thermal interfaces, and airflow management.

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