Part Image

5CEFA5F23I7N - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Cyclone V E 2908 LABs 240 IOs

Download 5CEFA5F23I7N Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
5CEFA5F23I7N - Intel PCB footprint - BGA - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00_1-ren1
click to zoom
3D Models
5CEFA5F23I7N - Intel  - 3D model - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00_1-ren1
click to zoom

5CEFA5F23I7N Details

  • Manufacturer Part Number:

    5CEFA5F23I7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, FBGA-484

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B484

  • Length:

    23 mm

  • Number of Inputs:

    240

  • Number of Logic Cells:

    76500

  • Number of Outputs:

    240

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    2908 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

5CEFA5F23I7N Frequently Asked Questions (FAQs)

  • The maximum operating temperature of the 5CEFA5F23I7N is typically specified in the datasheet, but if not, it's usually around 85°C to 100°C, depending on the specific application and use case.
  • The power management for the 5CEFA5F23I7N would depend on the specific requirements of your design. You may need to use power gating, clock gating, or dynamic voltage and frequency scaling to optimize power consumption. Consult the datasheet and application notes for more information.
  • The recommended PCB layout for the 5CEFA5F23I7N would depend on the specific package type and pinout. Generally, it's recommended to follow the guidelines provided in the datasheet and application notes, and to use a 4-layer or 6-layer PCB with a solid ground plane to minimize noise and EMI.
  • To troubleshoot issues with the 5CEFA5F23I7N, start by consulting the datasheet and application notes. Check for proper power supply, clock signal, and reset signal. Use oscilloscopes and logic analyzers to debug the signals. If the issue persists, contact Intel Corporation's support team for further assistance.
  • The thermal management considerations for the 5CEFA5F23I7N would depend on the specific application and use case. Generally, it's recommended to use a heat sink or a thermal interface material to dissipate heat. Consult the datasheet and application notes for more information on thermal design and management.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

5CEFA5F23I7N Overview

Use the download button to access the 5CEFA5F23I7N schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 5CEFA, or try a keyword search, such as Field Programmable Gate Arrays

Parts related to 5CEFA5F23I7N

Showing 0 results