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5CEFA7F31C8N - Intel

Description: FPGA Cyclone® V E Family 149500 Cells 28nm Technology 1.1V 896-Pin FBGA

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5CEFA7F31C8N - Intel PCB footprint - BGA - BGA - 896-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CEFA7F31C8N - Intel  - 3D model - BGA - 896-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CEFA7F31C8N Details

  • Manufacturer Part Number:

    5CEFA7F31C8N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, FBGA-896

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B896

  • Length:

    31 mm

  • Number of Inputs:

    488

  • Number of Logic Cells:

    149500

  • Number of Outputs:

    488

  • Number of Terminals:

    896

  • Operating Temperature-Max:

    85 °C

  • Organization:

    5648 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA896,30X30,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    31 mm

5CEFA7F31C8N Frequently Asked Questions (FAQs)

  • Intel provides a PCB design guide and thermal management guidelines in their documentation, but it's recommended to consult with Intel's technical support or a qualified PCB design expert for specific guidance.
  • Intel provides power estimation tools and guidelines in their documentation. Additionally, consider using power-saving features like clock gating, dynamic voltage and frequency scaling, and optimizing the design for low power consumption.
  • Use Intel's security features like bitstream encryption, authentication, and access controls. Implement secure boot mechanisms, and consider using a secure element like a Trusted Platform Module (TPM) to protect the FPGA's configuration.
  • Follow Intel's guidelines for environmental operating conditions, and consider using conformal coating, potting, or other environmental protection methods to ensure reliable operation in harsh environments.
  • Intel provides a comprehensive design flow and toolset, including Quartus Prime software, ModelSim simulation, and the Intel FPGA SDK for OpenCL. Consult Intel's documentation and online resources for guidance on design flows and tools.

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