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5CEFA7F31I7N - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Cyclone V E 5648 LABs 480 IOs

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PCB Footprints
5CEFA7F31I7N - Intel PCB footprint - BGA - BGA - 896-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CEFA7F31I7N - Intel  - 3D model - BGA - 896-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CEFA7F31I7N Details

  • Manufacturer Part Number:

    5CEFA7F31I7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, FBGA-896

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B896

  • Length:

    31 mm

  • Number of Inputs:

    488

  • Number of Logic Cells:

    149500

  • Number of Outputs:

    488

  • Number of Terminals:

    896

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    5648 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA896,30X30,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    31 mm

5CEFA7F31I7N Frequently Asked Questions (FAQs)

  • Intel provides a PCB layout guide and thermal management guidelines in the '5CEFA7F31I7N FPGA Development Kit User Guide' and '5CEFA7F31I7N FPGA Thermal Management' documents, respectively.
  • Use the Intel Quartus Prime Power Analyzer to estimate power consumption, and implement power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).
  • Use Intel's FPGA security features, such as the 'Configuration Bitstream Encryption' and 'Authentication' features, and implement secure boot mechanisms to protect the FPGA's configuration.
  • Implement error correction mechanisms, such as CRC and ECC, and use Intel's recommended PCB layout and signal integrity guidelines to minimize signal degradation and noise.
  • Consult the '5CEFA7F31I7N FPGA Handbook' and 'Intel Quartus Prime Handbook' for guidelines on using embedded hard IP blocks, and be aware of any limitations, such as resource utilization and clock domain crossing.

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