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5CEFA7U19I7N - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Cyclone V E 5648 LABs 240 IOs

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PCB Footprints
5CEFA7U19I7N - Intel PCB footprint - BGA - BGA - 484-Pin Ul tra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.90
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5CEFA7U19I7N - Intel  - 3D model - BGA - 484-Pin Ul tra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.90
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5CEFA7U19I7N Details

  • Manufacturer Part Number:

    5CEFA7U19I7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, UBGA-484

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B484

  • Length:

    19 mm

  • Number of Inputs:

    230

  • Number of Logic Cells:

    149500

  • Number of Outputs:

    230

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    5648 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA484,22X22,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.9 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    19 mm

5CEFA7U19I7N Frequently Asked Questions (FAQs)

  • Intel provides a PCB design guide and thermal management guidelines in their documentation, but it's essential to consult with experienced engineers and perform thermal simulations to ensure optimal design.
  • Implement power-saving techniques like clock gating, voltage scaling, and dynamic voltage and frequency scaling. Additionally, use Intel's PowerPlay power analysis tool to identify areas for optimization.
  • Use Intel's Secure Boot and authentication mechanisms, implement encryption and secure key storage, and follow secure development lifecycle practices to protect your IP.
  • Use Intel's recommended memory interfaces and protocols, implement data buffering and caching, and optimize data transfer rates using techniques like DMA and burst mode.
  • Consult Intel's radiation-tolerant FPGA documentation, follow guidelines for single-event upset (SEU) mitigation, and consider using radiation-hardened FPGAs or implementing error correction mechanisms.

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Part Image 5CEFA7U19I7N Altera Corporation

Field Programmable Gate Array, 149500-Cell, CMOS, PBGA484