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5CEFA9F23C7N - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Cyclone V E 11356 LABs 224 IOs

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5CEFA9F23C7N - Intel - PCB symbol
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PCB Footprints
5CEFA9F23C7N - Intel PCB footprint - BGA - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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3D Models
5CEFA9F23C7N - Intel - 3D model - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CEFA9F23C7N Details

  • Manufacturer Part Number:

    5CEFA9F23C7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, FBGA-484

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B484

  • Length:

    23 mm

  • Number of Inputs:

    230

  • Number of Logic Cells:

    301000

  • Number of Outputs:

    230

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Organization:

    11356 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

5CEFA9F23C7N Frequently Asked Questions (FAQs)

  • The maximum operating temperature of the 5CEFA9F23C7N is typically specified in the datasheet, but if not, it's usually around 85°C for commercial-grade parts.
  • The power sequencing requirements for the 5CEFA9F23C7N should be specified in the datasheet. If not, it's recommended to follow the recommended power-up and power-down sequences to prevent damage to the device.
  • The recommended PCB layout for the 5CEFA9F23C7N should be specified in the datasheet or in a separate application note. If not, it's recommended to follow general PCB design guidelines for the specific package type and to consult with a PCB design expert.
  • To troubleshoot issues with the 5CEFA9F23C7N, start by consulting the datasheet and application notes. Check for proper power supply, clocking, and signal integrity. Use oscilloscopes and logic analyzers to debug the issue. If still stuck, contact Intel Corporation's support team or a qualified engineer.
  • The thermal management considerations for the 5CEFA9F23C7N should be specified in the datasheet. If not, it's recommended to follow general thermal management guidelines for the specific package type and to consult with a thermal management expert.

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5CEFA9F23C7N Overview

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