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5CEFA9F23I7N - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Cyclone V E 11356 LABs 224 IOs

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Symbol
5CEFA9F23I7N - Intel - PCB symbol
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PCB Footprints
5CEFA9F23I7N - Intel PCB footprint - BGA - BGA - 484-Pin FineLine Ball-Grid Array (FBGA
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3D Models
5CEFA9F23I7N - Intel - 3D model - BGA - 484-Pin FineLine Ball-Grid Array (FBGA
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5CEFA9F23I7N Details

  • Manufacturer Part Number:

    5CEFA9F23I7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, FBGA-484

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Number of Inputs:

    230

  • Number of Logic Cells:

    301000

  • Number of Outputs:

    230

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    11356 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

5CEFA9F23I7N Frequently Asked Questions (FAQs)

  • Intel provides guidelines for PCB layout in their application notes and whitepapers. It's essential to follow these guidelines to ensure optimal thermal performance and reduce the risk of thermal-related issues.
  • Intel provides debugging tools and software development kits (SDKs) to help troubleshoot power management issues. Additionally, consulting the device's datasheet and application notes can provide valuable insights into power management.
  • While the datasheet provides some information on operating conditions, it's essential to consult Intel's application notes and technical documentation for more detailed information on recommended operating conditions, including temperature, voltage, and humidity ranges.
  • Intel provides guidelines for EMC in their application notes and technical documentation. It's essential to follow these guidelines to ensure compliance with EMC regulations and to minimize the risk of electromagnetic interference (EMI).
  • Intel provides thermal design guidelines in their application notes and technical documentation. It's essential to follow these guidelines to ensure optimal thermal performance and reduce the risk of thermal-related issues.

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5CEFA9F23I7N Overview

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