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5CEFA9F27C7N - Intel

Description: FPGA Cyclone® V E Family 301000 Cells 28nm Technology 1.1V 672-Pin FBGA

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5CEFA9F27C7N - Intel PCB footprint - BGA - BGA - 672-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CEFA9F27C7N - Intel  - 3D model - BGA - 672-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CEFA9F27C7N Details

  • Manufacturer Part Number:

    5CEFA9F27C7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, FBGA-672

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B672

  • Length:

    27 mm

  • Number of Inputs:

    336

  • Number of Logic Cells:

    301000

  • Number of Outputs:

    336

  • Number of Terminals:

    672

  • Operating Temperature-Max:

    85 °C

  • Organization:

    11356 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA672,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    27 mm

5CEFA9F27C7N Frequently Asked Questions (FAQs)

  • Intel provides a PCB design guide for Cyclone V SoC FPGAs, which includes recommendations for layer stackup, signal routing, and decoupling. It's essential to follow these guidelines to ensure signal integrity and minimize electromagnetic interference.
  • To optimize power consumption, use the Intel PowerPlay Early Power Estimator (EPE) tool to estimate power consumption based on your design. Additionally, implement power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
  • The Cyclone V SoC FPGA has a maximum junction temperature of 100°C. Ensure proper thermal management by using a heat sink, thermal interface material, and a well-designed PCB with adequate thermal vias. Monitor the device temperature using the on-chip thermal sensor.
  • Use the Intel FPGA's built-in security features, such as the Secure Boot mechanism, to ensure a secure boot process. Implement authentication and encryption mechanisms, such as AES and SHA, to protect the FPGA's configuration and data.
  • Intel provides the Quartus II software, which includes a comprehensive development environment for designing, simulating, and programming the Cyclone V SoC FPGA. Additionally, Intel offers the SoC Embedded Design Suite (EDS) for developing software applications.

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Part Image 5CEFA9F27C7N Altera Corporation

Field Programmable Gate Array, 301000-Cell, CMOS, PBGA672