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5CEFA9F31C7N - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Cyclone V E 11356 LABs 480 IOs

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5CEFA9F31C7N - Intel PCB footprint - BGA - BGA - 896-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CEFA9F31C7N - Intel  - 3D model - BGA - 896-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CEFA9F31C7N Details

  • Manufacturer Part Number:

    5CEFA9F31C7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, FBGA-896

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B896

  • Length:

    31 mm

  • Number of Inputs:

    488

  • Number of Logic Cells:

    301000

  • Number of Outputs:

    488

  • Number of Terminals:

    896

  • Operating Temperature-Max:

    85 °C

  • Organization:

    11356 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA896,30X30,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    31 mm

5CEFA9F31C7N Frequently Asked Questions (FAQs)

  • Intel provides a PCB design guide and thermal management guidelines in their documentation, but it's recommended to consult with Intel's technical support or a qualified PCB design expert for specific guidance.
  • Optimize power consumption by using Intel's PowerPlay Early Power Estimator (EPE) tool, and implement power-saving techniques like clock gating, voltage scaling, and dynamic voltage and frequency scaling. Additionally, consider using a heat sink or thermal interface material to reduce thermal resistance.
  • Use Intel's FPGA security features like bitstream encryption, authentication, and secure boot mechanisms. Implement access controls, secure key management, and consider using a secure boot loader. Consult Intel's security documentation and follow best practices for secure FPGA design.
  • Characterize the FPGA's performance across various temperatures, voltages, and frequencies. Use Intel's device models and simulation tools to validate your design. Implement robust clocking and reset strategies, and consider using environmental sensors to monitor operating conditions.
  • Use Intel's Quartus Prime design software and IP Catalog for developing and verifying IP cores. Follow Intel's recommended design flows and guidelines for IP core development, and consider using third-party EDA tools for additional functionality.

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5CEFA9F31C7N Overview

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Part Image 5CEFA9F31C7N Altera Corporation

Field Programmable Gate Array, 301000-Cell, CMOS, PBGA896