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5CEFA9F31I7N - Intel

Description: IC FPGA 480 I/O 896FBGA

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PCB Footprints
5CEFA9F31I7N - Intel PCB footprint - BGA - BGA - 896-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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3D Models
5CEFA9F31I7N - Intel  - 3D model - BGA - 896-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CEFA9F31I7N Details

  • Manufacturer Part Number:

    5CEFA9F31I7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, FBGA-896

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B896

  • JESD-609 Code:

    e1

  • Length:

    31 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    488

  • Number of Logic Cells:

    301000

  • Number of Outputs:

    488

  • Number of Terminals:

    896

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    11356 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA896,30X30,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    31 mm

5CEFA9F31I7N Frequently Asked Questions (FAQs)

  • Intel provides a PCB layout guide and thermal management guidelines in their documentation, but it's essential to consult with experienced engineers and perform thermal simulations to ensure optimal design.
  • Implement power-saving techniques like clock gating, voltage scaling, and dynamic voltage and frequency scaling. Additionally, use Intel's PowerPlay power analysis tool to identify areas for optimization.
  • Use Intel's Secure Boot and authentication mechanisms, implement encryption and secure key storage, and follow secure development lifecycle practices to protect your IP.
  • Implement a well-designed memory hierarchy, use Intel's optimized IP cores for memory interfaces, and consider using Intel's high-speed transceivers for high-bandwidth data transfer.
  • Hard IP cores offer better performance and power efficiency, but may limit flexibility. Soft IP cores provide more flexibility, but may require more resources and power. Choose based on your specific design requirements.

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5CEFA9F31I7N Overview

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