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5CGTFD5C5F27C7N - Intel

Description: FPGA - Field Programmable Gate Array

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5CGTFD5C5F27C7N - Intel PCB footprint - BGA - BGA - 672-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CGTFD5C5F27C7N - Intel  - 3D model - BGA - 672-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CGTFD5C5F27C7N Details

  • Manufacturer Part Number:

    5CGTFD5C5F27C7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, FBGA-672

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B672

  • JESD-609 Code:

    e1

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    368

  • Number of Logic Cells:

    76500

  • Number of Outputs:

    368

  • Number of Terminals:

    672

  • Operating Temperature-Max:

    85 °C

  • Organization:

    2908 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA672,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    27 mm

5CGTFD5C5F27C7N Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for most Intel FPGAs is typically between -40°C to 100°C, but it's essential to check the specific datasheet for the exact part number.
  • A reliable clocking scheme involves using a high-quality clock source, such as a crystal oscillator, and ensuring proper clock domain crossing and synchronization. Intel provides guidelines and IP cores for clock management in their documentation.
  • Best practices include using power gating, dynamic voltage and frequency scaling, and thermal management techniques like heat sinks and thermal interfaces. Intel provides power management guidelines and thermal design considerations in their documentation.
  • Optimization involves understanding the application's requirements, using the right synthesis and place-and-route strategies, and leveraging Intel's optimization tools and IP cores. It's essential to consult Intel's documentation and application notes for specific guidance.
  • Recommended PCB design and layout considerations include using a multi-layer board, following Intel's guidelines for signal integrity, and ensuring proper power distribution and decoupling. Intel provides PCB design guidelines and layout recommendations in their documentation.

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