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5CGXFC3B6U15I7N - Intel

Description: FPGA Cyclone® V GX Family 31500 Cells 28nm Technology 1.1V 324-Pin UBGA Tray

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5CGXFC3B6U15I7N - Intel PCB footprint - BGA - BGA - 324-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.50
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5CGXFC3B6U15I7N - Intel  - 3D model - BGA - 324-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.50
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5CGXFC3B6U15I7N Details

  • Manufacturer Part Number:

    5CGXFC3B6U15I7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    UBGA-324

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B324

  • Length:

    15 mm

  • Number of CLBs:

    1346

  • Number of Inputs:

    112

  • Number of Logic Cells:

    31000

  • Number of Outputs:

    112

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1346 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA324,18X18,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    15 mm

5CGXFC3B6U15I7N Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 5CGXFC3B6U15I7N is -40°C to 100°C.
  • Intel recommends using an external POR circuit with a voltage supervisor IC, such as the MAX809, to ensure a reliable power-on reset.
  • Intel provides guidelines for PCB layout and routing in the 'Intel FPGA PCB Design Guidelines' document, which includes recommendations for signal integrity, power distribution, and thermal management.
  • To optimize timing closure, use the Intel Quartus Prime software to analyze and optimize the design, and consider using techniques such as pipelining, retiming, and clock domain crossing.
  • The recommended settings for the IVR depend on the specific application, but generally, it's recommended to set the IVR to the 'Auto' mode, which allows the FPGA to dynamically adjust the voltage based on the operating conditions.

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