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5CGXFC5C7F23C8N - Intel

Description: FPGA - Field Programmable Gate Array

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5CGXFC5C7F23C8N - Intel PCB footprint - BGA - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond -  A:2.00
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5CGXFC5C7F23C8N - Intel  - 3D model - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond -  A:2.00
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5CGXFC5C7F23C8N Details

  • Manufacturer Part Number:

    5CGXFC5C7F23C8N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-484

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    2908

  • Number of Inputs:

    240

  • Number of Logic Cells:

    77000

  • Number of Outputs:

    240

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Organization:

    2908 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

5CGXFC5C7F23C8N Frequently Asked Questions (FAQs)

  • The 5CGXFC5C7F23C8N FPGA has an operating temperature range of 0°C to 100°C (TJ).
  • Intel recommends using an external POR circuit with a voltage supervisor IC, such as the MAX809, to ensure a reliable power-on reset. The FPGA's internal POR circuit can also be used, but it may not be as reliable.
  • Intel provides guidelines for PCB layout and routing in the 'Intel FPGA PCB Design Guidelines' document. It's essential to follow these guidelines to ensure signal integrity, reduce noise, and prevent electromagnetic interference (EMI).
  • To optimize power consumption, use the Intel Quartus Prime software to optimize the design for power, reduce clock frequencies, and use the FPGA's built-in power-saving features, such as the 'Power Aware' feature. Additionally, consider using a heat sink or thermal management system to reduce heat generation.
  • The recommended settings for configuration and programming can be found in the 'Intel FPGA Configuration Handbook' and the 'Intel Quartus Prime Software Suite' documentation. It's essential to follow these guidelines to ensure reliable configuration and programming of the FPGA.

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5CGXFC5C7F23C8N Overview

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Part Image 5CGXFC5C7F23C8 Intel Corporation

Field Programmable Gate Array, 2908 CLBS, 77000-Cell, CMOS, PBGA484