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5CGXFC7B6M15I7N - Intel

Description: FPGA Cyclone® V GX Family 149500 Cells 28nm Technology 1.1V 484-Pin MBGA

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5CGXFC7B6M15I7N - Intel PCB footprint - BGA - BGA - 484-Pin Micro FineLine Ball-Grid Array (MBGA) - Wire Bond - A:1.25
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5CGXFC7B6M15I7N - Intel  - 3D model - BGA - 484-Pin Micro FineLine Ball-Grid Array (MBGA) - Wire Bond - A:1.25
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5CGXFC7B6M15I7N Details

  • Manufacturer Part Number:

    5CGXFC7B6M15I7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, MBGA-484

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B484

  • Length:

    15 mm

  • Number of Inputs:

    240

  • Number of Logic Cells:

    149500

  • Number of Outputs:

    240

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    5648 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA484,28X28,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.25 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    15 mm

5CGXFC7B6M15I7N Frequently Asked Questions (FAQs)

  • The 5CGXFC7B6M15I7N FPGA has an operating temperature range of 0°C to 100°C (TJ).
  • Intel recommends using an external POR circuit with a voltage supervisor IC, such as the MAX809, to ensure a reliable power-on reset. The FPGA's internal POR circuit can also be used, but it may not be as reliable.
  • Intel provides a PCB design guide for the 5CGXFC7B6M15I7N FPGA, which recommends a 4-layer PCB with a specific stack-up and routing strategy to minimize signal integrity issues and ensure reliable operation.
  • To optimize power consumption, use the Intel Quartus Prime software to optimize the design for power, reduce clock frequencies, and use the FPGA's built-in power management features, such as the Power Manager IP core.
  • Intel recommends using 0.1 μF and 10 μF decoupling capacitors, placed as close as possible to the FPGA's power pins, to ensure reliable power supply decoupling and noise reduction.

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5CGXFC7B6M15I7N Overview

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Part Image 5CGXFC7B6M15I7N Altera Corporation

Field Programmable Gate Array, 149500-Cell, CMOS, PBGA484