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5CGXFC7C6F23I7N - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Cyclone V GX 5648 LABs 240 IOs

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5CGXFC7C6F23I7N - Intel PCB footprint - BGA - BGA - 484-Pin FBGA - Flip Chip
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5CGXFC7C6F23I7N - Intel  - 3D model - BGA - 484-Pin FBGA - Flip Chip
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5CGXFC7C6F23I7N Details

  • Manufacturer Part Number:

    5CGXFC7C6F23I7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, FBGA-484

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    240

  • Number of Logic Cells:

    149500

  • Number of Outputs:

    240

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    5648 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

5CGXFC7C6F23I7N Frequently Asked Questions (FAQs)

  • Intel recommends a 4-6 layer PCB stackup with a minimum of two power planes and two ground planes. The top and bottom layers should be used for signal routing, and the inner layers for power and ground distribution. Additionally, Intel provides a PCB design guide and reference design files to help with the layout.
  • To optimize power consumption, use the Intel Power Estimator tool to estimate power consumption and identify areas for optimization. Implement power-saving techniques such as clock gating, dynamic voltage and frequency scaling, and use low-power modes. For thermal design, ensure good airflow, use a heat sink or thermal interface material, and follow Intel's thermal design guidelines.
  • Use Intel's FPGA Security features such as the Secure Device Manager, AES encryption, and authentication mechanisms to protect the configuration and bitstream. Implement secure boot mechanisms, use secure communication protocols, and follow Intel's security guidelines to prevent unauthorized access and tampering.
  • Use Intel's FPGA development tools such as the Quartus II software, SignalTap II logic analyzer, and the FPGA's built-in debugging features. Implement debug signals and test points in the design, and use Intel's debugging guidelines and troubleshooting resources to identify and resolve issues.
  • Intel provides migration guides and documentation to help with the transition. Key considerations include differences in device architecture, clocking, and I/O interfaces. Review the 5CGXFC7C6F23I7N datasheet and Intel's migration resources to ensure a smooth transition and optimal design implementation.

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5CGXFC7C6F23I7N Overview

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Part Image 5CGXFC7C6F23I7N Altera Corporation

Field Programmable Gate Array, 149500-Cell, CMOS, PBGA484