Part Image

5CSEBA2U19I7N - Intel

Description: FPGA Cyclone® V SE Family 25000 Cells 28nm Technology 1.1V 484-Pin UFBGA Tray

Download 5CSEBA2U19I7N Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
5CSEBA2U19I7N - Intel PCB footprint - BGA - BGA - 484-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.90*-*
click to zoom
3D Models
5CSEBA2U19I7N - Intel  - 3D model - BGA - 484-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.90*-*
click to zoom

5CSEBA2U19I7N Details

  • Manufacturer Part Number:

    5CSEBA2U19I7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, UBGA-484

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B484

  • Length:

    19 mm

  • Number of Inputs:

    217

  • Number of Outputs:

    217

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    943 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA484,22X22,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.9 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    19 mm

5CSEBA2U19I7N Frequently Asked Questions (FAQs)

  • A multi-layer PCB with a mix of power and ground planes is recommended. Use a grid-based layout with 50-ohm transmission lines for high-speed signals.
  • Use the Intel PowerPlay Early Power Estimator (EPE) tool to estimate power consumption. Optimize by reducing clock frequencies, using low-power modes, and minimizing toggle rates.
  • Use a heat sink or thermal interface material to manage heat. Ensure good airflow and consider using a fan. Monitor the FPGA's temperature using the on-chip thermal sensor.
  • Use IBIS models to simulate signal integrity. Implement signal termination, use differential signaling, and add capacitors to reduce noise and ringing.
  • Use the Intel Quartus II software to configure the clocking architecture. Ensure clock domains are properly isolated, and use clock domain crossing (CDC) techniques to minimize metastability.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

5CSEBA2U19I7N Overview

Use the download button to access the 5CSEBA2U19I7N schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 5CSEB, or try a keyword search, such as Field Programmable Gate Arrays

Parts related to 5CSEBA2U19I7N

Showing 0 results