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5CSEBA5U23C7N - Intel

Description: FPGA Cyclone® V SE Family 85000 Cells 28nm Technology 1.1V 672-Pin UBGA Tray

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5CSEBA5U23C7N - Intel PCB footprint - BGA - BGA - 5CSEBA5U23C7N
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5CSEBA5U23C7N - Intel  - 3D model - BGA - 5CSEBA5U23C7N
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5CSEBA5U23C7N Details

  • Manufacturer Part Number:

    5CSEBA5U23C7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, UBGA-672

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B672

  • Length:

    23 mm

  • Number of Inputs:

    326

  • Number of Outputs:

    326

  • Number of Terminals:

    672

  • Operating Temperature-Max:

    85 °C

  • Organization:

    3207 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA672,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.85 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

5CSEBA5U23C7N Frequently Asked Questions (FAQs)

  • Intel provides a PCB design guide for Cyclone V FPGAs, which includes recommendations for layer stackup, signal routing, and decoupling. It's essential to follow these guidelines to ensure signal integrity and minimize electromagnetic interference (EMI).
  • To optimize power consumption, use Intel's PowerPlay power analysis tool to identify areas of high power consumption. Implement power gating, clock gating, and dynamic voltage and frequency scaling (DVFS) to reduce power consumption. For thermal management, ensure proper heat sink design, thermal interface material selection, and airflow management.
  • Implement a secure boot process using Intel's Secure Boot mechanism. Use encryption and secure key storage to protect sensitive data. Ensure secure communication protocols, such as SSL/TLS, are used for data transmission. Regularly update your design with security patches and follow Intel's security guidelines.
  • Use Intel's SignalTap II logic analyzer to capture and analyze signals within the FPGA. Implement debug ports and use Intel's Debug Toolkit to access and debug the FPGA. Utilize the FPGA's built-in debugging features, such as the System Console and the Debug Module.
  • The HPS is a dual-core ARM Cortex-A9 processor. Be aware of its limitations, such as memory bandwidth and cache size. Ensure proper synchronization and communication between the HPS and FPGA fabric. Use Intel's SoC Embedded Design Suite (EDS) to develop and optimize HPS-based designs.

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5CSEBA5U23C7N Overview

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