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5CSEBA5U23I7N - Intel

Description: SoC FPGA Cyclone V SE dual -core ARM Cortex-A9

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5CSEBA5U23I7N - Intel PCB footprint - BGA - BGA - 672-Pin Ultra FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CSEBA5U23I7N - Intel  - 3D model - BGA - 672-Pin Ultra FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CSEBA5U23I7N Details

  • Manufacturer Part Number:

    5CSEBA5U23I7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    23 MM, ROHS COMPLIANT, UBGA-672

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • Clock Frequency-Max:

    622 MHz

  • JESD-30 Code:

    S-PBGA-B672

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    326

  • Number of Outputs:

    326

  • Number of Terminals:

    672

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    3207 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA672,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.85 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

5CSEBA5U23I7N Frequently Asked Questions (FAQs)

  • A multi-layer PCB with a solid ground plane and careful signal routing is recommended to minimize noise and ensure signal integrity.
  • Use the PowerPlay Early Power Estimator (EPE) tool to estimate power consumption, and implement power-saving techniques like clock gating, dynamic voltage and frequency scaling, and power gating.
  • Use a heat sink or thermal interface material, ensure good airflow, and consider using a fan or heat pipe to keep the junction temperature below 85°C.
  • Use controlled impedance traces, add series terminations, and implement signal shielding to minimize electromagnetic interference (EMI) and ensure signal integrity.
  • The internal oscillator has a limited frequency range (10-50 MHz) and accuracy (±5%), so consider using an external clock source for more precise timing requirements.

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5CSEBA5U23I7N Overview

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