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5CSEBA6U23C7N - Intel

Description: FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9

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5CSEBA6U23C7N - Intel PCB footprint - BGA - BGA - 672-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.85-1
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5CSEBA6U23C7N - Intel  - 3D model - BGA - 672-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.85-1
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5CSEBA6U23C7N Details

  • Manufacturer Part Number:

    5CSEBA6U23C7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, UBGA-672

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B672

  • Length:

    23 mm

  • Number of Inputs:

    326

  • Number of Outputs:

    326

  • Number of Terminals:

    672

  • Operating Temperature-Max:

    85 °C

  • Organization:

    4191 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA672,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.85 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

5CSEBA6U23C7N Frequently Asked Questions (FAQs)

  • Intel provides a PCB design guide and thermal management guidelines in their documentation, but it's essential to consult with experienced engineers and perform thermal simulations to ensure optimal design.
  • Use Intel's PowerPlay Early Power Estimator (EPE) tool to estimate power consumption. Optimize your design by reducing clock frequencies, using low-power modes, and implementing power-gating techniques.
  • Use Intel's Secure Device Manager to encrypt and authenticate the FPGA's configuration. Implement secure boot mechanisms, and consider using a secure element, such as a Trusted Platform Module (TPM), to protect your IP.
  • Follow Intel's guidelines for transceiver calibration and optimization. Implement error correction mechanisms, such as CRC and FEC, and consider using a redundant transmission scheme to ensure data integrity.
  • Consult Intel's documentation for specific guidelines on using the hard IP blocks, such as the DSP and PCIe blocks. Be aware of any limitations on resource utilization, clock frequencies, and data widths.

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5CSEBA6U23C7N Overview

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