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5CSEBA6U23I7N - Intel

Description: FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9

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5CSEBA6U23I7N - Intel PCB footprint - BGA - BGA - 672-Pin UBGA - Wire Bond - A:1.85
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5CSEBA6U23I7N - Intel  - 3D model - BGA - 672-Pin UBGA - Wire Bond - A:1.85
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5CSEBA6U23I7N Details

  • Manufacturer Part Number:

    5CSEBA6U23I7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, UBGA-672

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B672

  • Length:

    23 mm

  • Number of Inputs:

    326

  • Number of Outputs:

    326

  • Number of Terminals:

    672

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4191 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA672,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.85 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

5CSEBA6U23I7N Frequently Asked Questions (FAQs)

  • Intel provides a reference design guide for PCB layout, which includes guidelines for signal integrity, power distribution, and thermal management.
  • Use the Intel Power Analyzer tool to estimate power consumption, and implement power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
  • Implement a secure boot process using the FPGA's built-in security features, such as the Root of Trust (RoT) and the Secure Boot mechanism, to ensure the authenticity and integrity of the FPGA's configuration.
  • Use the Intel SoC Embedded Design Suite (EDS) to debug and troubleshoot configuration issues, and leverage the FPGA's built-in debug features, such as the Configuration Debug Interface (CDI).
  • Ensure proper thermal management by providing adequate heat sinks, thermal interfaces, and airflow, and by implementing thermal monitoring and throttling mechanisms to prevent overheating.

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