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5CSEMA4U23C6N - Intel

Description: FPGA - Field Programmable Gate Array CycloneV SoC SE dual -core ARM Cortex-A9

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5CSEMA4U23C6N - Intel - PCB symbol
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PCB Footprints
5CSEMA4U23C6N - Intel PCB footprint - BGA - BGA - 672-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.85
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3D Models
5CSEMA4U23C6N - Intel - 3D model - BGA - 672-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.85
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5CSEMA4U23C6N Details

  • Manufacturer Part Number:

    5CSEMA4U23C6N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, UBGA-672

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B672

  • Length:

    23 mm

  • Number of Inputs:

    326

  • Number of Outputs:

    326

  • Number of Terminals:

    672

  • Operating Temperature-Max:

    85 °C

  • Organization:

    1588 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA672,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.85 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

5CSEMA4U23C6N Frequently Asked Questions (FAQs)

  • Intel recommends a 4-6 layer PCB stack-up with a minimum of 2 mil trace width and 2 mil spacing. A dedicated ground plane and power plane are also recommended for optimal signal integrity.
  • Use the Intel Power Estimator tool to estimate power consumption based on your design's specific requirements. Optimize power consumption by using low-power modes, clock gating, and dynamic voltage and frequency scaling.
  • Use a heat sink with a thermal interface material, ensure good airflow, and consider using a fan. Keep the FPGA away from other heat sources and ensure good thermal conduction paths.
  • Use the Intel FPGA's built-in boot mechanisms, such as the boot ROM or external boot devices. Implement secure boot mechanisms, such as authentication and encryption, to ensure the integrity of your design.
  • Use differential signaling, controlled impedance, and matched length traces. Implement signal termination, and use Intel's signal integrity tools to analyze and optimize your design.

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5CSEMA4U23C6N Overview

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