Part Image

5CSEMA5F31C8N - Intel

Description: Altera FPGA 5CSEMA5F31C8N, Cyclone V SE 85000 Cells, 85000 Gates, 4450K, 32075 Blocks, 896-Pin FBGA

Download 5CSEMA5F31C8N Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
5CSEMA5F31C8N - Intel PCB footprint - BGA - BGA - 896-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
click to zoom
3D Models
5CSEMA5F31C8N - Intel  - 3D model - BGA - 896-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
click to zoom

5CSEMA5F31C8N Details

  • Manufacturer Part Number:

    5CSEMA5F31C8N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, FBGA-896

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B896

  • JESD-609 Code:

    e1

  • Length:

    31 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    469

  • Number of Outputs:

    469

  • Number of Terminals:

    896

  • Operating Temperature-Max:

    85 °C

  • Organization:

    3207 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA896,30X30,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    31 mm

5CSEMA5F31C8N Frequently Asked Questions (FAQs)

  • Intel provides a reference design guide for the 5CSEMA5F31C8N, which includes recommendations for PCB layout, thermal design, and power delivery. It's essential to follow these guidelines to ensure optimal performance and thermal management.
  • Intel provides a Pin Connection Guidelines document that helps optimize pin configuration for specific applications. Additionally, Intel's Quartus II software can be used to configure and optimize pin assignments.
  • The 5CSEMA5F31C8N has a maximum power consumption of 2.5W. Thermal management is crucial, and Intel recommends using a heat sink or thermal interface material to maintain a junction temperature below 100°C. A thermal design guide is available from Intel to help with thermal management.
  • To ensure signal integrity, follow Intel's guidelines for signal routing, termination, and impedance matching. Additionally, use Intel's Signal Integrity Tool to analyze and optimize signal integrity in your design.
  • Intel recommends using a clock tree architecture to minimize clock skew and ensure synchronization. The Quartus II software provides tools to help optimize clocking and synchronization in your design.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

5CSEMA5F31C8N Overview

Use the download button to access the 5CSEMA5F31C8N schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 5CSEM, or try a keyword search, such as Field Programmable Gate Arrays

Parts related to 5CSEMA5F31C8N

Showing 0 results