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5CSTFD6D5F31I7N - Intel

Description: FPGA - Field Programmable Gate Array Cyclone V ST dual -core ARM Cortex-A9

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5CSTFD6D5F31I7N - Intel PCB footprint - BGA - BGA - 896-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CSTFD6D5F31I7N - Intel  - 3D model - BGA - 896-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CSTFD6D5F31I7N Details

  • Manufacturer Part Number:

    5CSTFD6D5F31I7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, FBGA-896

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B896

  • JESD-609 Code:

    e1

  • Length:

    31 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    469

  • Number of Outputs:

    469

  • Number of Terminals:

    896

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4191 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA896,30X30,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    31 mm

5CSTFD6D5F31I7N Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 5CSTFD6D5F31I7N is -40°C to 100°C.
  • Intel recommends using an external POR circuit with a voltage supervisor IC, such as the MAX809, to ensure a reliable power-on reset.
  • Intel provides guidelines for PCB layout and routing in the Cyclone V SoC FPGA Development Kit User Guide. It's essential to follow these guidelines to ensure signal integrity and minimize noise.
  • To optimize power consumption, use the Intel Quartus II Power Play Early Power Estimator (EPE) tool to analyze and optimize power consumption during the design process. Additionally, consider using power-saving features like clock gating and dynamic voltage and frequency scaling.
  • Intel recommends using a combination of high-frequency and low-frequency decoupling capacitors, with values ranging from 0.01 μF to 10 μF, placed close to the FPGA's power pins.

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5CSTFD6D5F31I7N Overview

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