Part Image

5CSXFC5D6F31I7N - Intel

Description: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Cyclone® V SX FPGA - 85K Logic Elements 800MHz 896-FBGA (31x31)

Download 5CSXFC5D6F31I7N Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
5CSXFC5D6F31I7N - Intel PCB footprint - BGA - BGA - 896-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
click to zoom
3D Models
5CSXFC5D6F31I7N - Intel  - 3D model - BGA - 896-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
click to zoom

5CSXFC5D6F31I7N Details

  • Manufacturer Part Number:

    5CSXFC5D6F31I7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, FBGA-896

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B896

  • Length:

    31 mm

  • Number of Inputs:

    469

  • Number of Outputs:

    469

  • Number of Terminals:

    896

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    3207 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA896,30X30,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    31 mm

5CSXFC5D6F31I7N Frequently Asked Questions (FAQs)

  • The maximum operating frequency depends on the specific application and design. However, Intel's documentation suggests that the maximum clock frequency for this FPGA is around 500 MHz.
  • To optimize power consumption, consider using Intel's PowerPlay power analysis and optimization tool, as well as implementing power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
  • Intel provides a DDR3 memory interface IP core that can be used to implement DDR3 memory interfaces. Additionally, Intel's Quartus II software provides a DDR3 memory interface wizard to simplify the design process.
  • To ensure signal integrity, use Intel's signal integrity analysis tools, such as the Signal Integrity Toolkit, and follow best practices for PCB design, such as using differential pairs, adding termination resistors, and minimizing signal routing distances.
  • The 5CSXFC5D6F31I7N has a maximum junction temperature of 100°C. Ensure proper thermal management by using heat sinks, thermal interfaces, and airflow management to keep the FPGA within its operating temperature range.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

5CSXFC5D6F31I7N Overview

Use the download button to access the 5CSXFC5D6F31I7N schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 5CSXF, or try a keyword search, such as Field Programmable Gate Arrays

Parts related to 5CSXFC5D6F31I7N

Showing 0 results