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5CSXFC6C6U23C6N - Intel

Description: FPGA - Field Programmable Gate Array Cyclone V SX dual -core ARM Cortex-A9

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5CSXFC6C6U23C6N - Intel PCB footprint - BGA - BGA - 672-Pin Ultra FineLine Ball-Grid Array (UBGA)
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5CSXFC6C6U23C6N - Intel  - 3D model - BGA - 672-Pin Ultra FineLine Ball-Grid Array (UBGA)
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5CSXFC6C6U23C6N Details

  • Manufacturer Part Number:

    5CSXFC6C6U23C6N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, UBGA-672

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B672

  • Length:

    23 mm

  • Number of Inputs:

    326

  • Number of Outputs:

    326

  • Number of Terminals:

    672

  • Operating Temperature-Max:

    85 °C

  • Organization:

    4191 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA672,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.85 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

5CSXFC6C6U23C6N Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 5CSXFC6C6U23C6N is typically between -40°C to 100°C, but this may vary depending on the specific application and usage.
  • A reliable POR circuit can be implemented using a voltage supervisor IC, such as the TLV7031, which can detect power-on and power-off conditions and generate a reset signal for the FPGA.
  • A good PCB layout and routing strategy for this FPGA involves using a multi-layer board, separating analog and digital signals, and following Intel's guidelines for signal integrity and power distribution.
  • Optimizing timing closure involves using Intel's Quartus II software to analyze and optimize the design, as well as using techniques such as pipelining, retiming, and register duplication.
  • The recommended decoupling capacitor values and placement for this FPGA involve using a combination of high-frequency and low-frequency capacitors, placed close to the FPGA's power pins, with values ranging from 0.01 μF to 10 μF.

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5CSXFC6C6U23C6N Overview

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