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5CSXFC6D6F31I7N - Intel

Description: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Cyclone® V SX FPGA - 110K Logic Elements 800MHz 896-FBGA (31x31)

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5CSXFC6D6F31I7N - Intel PCB footprint - BGA - BGA - 896-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CSXFC6D6F31I7N - Intel  - 3D model - BGA - 896-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CSXFC6D6F31I7N Details

  • Manufacturer Part Number:

    5CSXFC6D6F31I7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, FBGA-896

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B896

  • Length:

    31 mm

  • Number of Inputs:

    469

  • Number of Outputs:

    469

  • Number of Terminals:

    896

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4191 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA896,30X30,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    31 mm

5CSXFC6D6F31I7N Frequently Asked Questions (FAQs)

  • The maximum operating frequency depends on the specific application and design. However, Intel's documentation suggests that the maximum clock frequency for this FPGA is around 500 MHz.
  • To optimize power consumption, consider using Intel's PowerPlay power analysis and optimization tool, as well as implementing power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
  • Intel provides a DDR3 memory interface IP core that can be used to implement DDR3 memory interfaces. Additionally, Intel's Quartus II software provides a DDR3 memory interface wizard to simplify the design process.
  • To ensure signal integrity, use Intel's signal integrity analysis tools, such as the Signal Integrity Toolkit, and follow best practices for PCB design, such as using differential pairs, adding termination resistors, and minimizing signal routing distances.
  • The 5CSXFC6D6F31I7N has a maximum junction temperature of 100°C. Ensure proper thermal management by using heat sinks, thermal interfaces, and following Intel's thermal design guidelines.

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