Part Image

5M2210ZF256C4N - Intel

Description: 5M2210ZF256C4N, CPLD MAX V Flash 1700 Cells, 203 I/O, 2210 Labs, 9.1ns, ISP, 1.71 → 1.89 V 256-Pin FBGA

Download 5M2210ZF256C4N Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
5M2210ZF256C4N - Intel PCB footprint - BGA - BGA - 256-Pin FineLine Ball-Grid Array (FBGA) - THIN - Wire Bond - A:1.55
click to zoom
3D Models
5M2210ZF256C4N - Intel  - 3D model - BGA - 256-Pin FineLine Ball-Grid Array (FBGA) - THIN - Wire Bond - A:1.55
click to zoom

5M2210ZF256C4N Details

  • Manufacturer Part Number:

    5M2210ZF256C4N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    5

  • Additional Feature:

    YES

  • Clock Frequency-Max:

    247.5 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • JTAG BST:

    YES

  • Length:

    17 mm

  • Number of I/O Lines:

    203

  • Number of Inputs:

    203

  • Number of Macro Cells:

    1700

  • Number of Outputs:

    203

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    85 °C

  • Organization:

    203 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Programmable Logic Type:

    FLASH PLD

  • Propagation Delay:

    9.1 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.89 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

5M2210ZF256C4N Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 5M2210ZF256C4N is -40°C to 100°C.
  • A reliable POR circuit can be implemented using a voltage supervisor IC, such as the TLV7031, which can detect power-on and power-down events and generate a reset signal to the FPGA.
  • A good PCB layout and routing strategy for the 5M2210ZF256C4N involves using a multi-layer board with a solid ground plane, separating analog and digital signals, and using controlled impedance routing for high-speed signals.
  • Optimizing timing closure for the 5M2210ZF256C4N involves using the Intel Quartus Prime software to analyze and optimize the design's timing, as well as using techniques such as pipelining, retiming, and clock domain crossing.
  • The recommended decoupling capacitor values for the 5M2210ZF256C4N are 0.1uF and 10uF, placed as close as possible to the FPGA's power pins, with the 0.1uF capacitor being the closest.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

5M2210ZF256C4N Overview

Use the download button to access the 5M2210ZF256C4N schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 5M221, or try a keyword search, such as Programmable Logic Devices

Parts related to 5M2210ZF256C4N

Showing 0 results

5M2210ZF256C4N Alternates

Showing results

Image Part Number Model
Part Image 5M2210ZF256C4 Intel Corporation

Flash PLD, 9.1ns, 1700-Cell, CMOS, PBGA256

Part Image 5M2210ZF256C4N Altera Corporation

Flash PLD, 9.1ns, 1700-Cell, CMOS, PBGA256