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5M40ZE64C4N - Intel

Description: CPLD, MAX V, 32 cell 184.1MHz, EQFP64 EP 5M40ZE64C4N, CPLD MAX V Flash 32 Cells, 30 I/O, 40 Labs, 7.9ns, ISP, 1.71 → 1.89 V 64-Pin EQFP

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5M40ZE64C4N - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 64-Pin Plastic Enhanced Quad Flat Pack (EQFP)—Wire Bond
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3D Models
5M40ZE64C4N - Intel  - 3D model - Quad Flat Packages - 64-Pin Plastic Enhanced Quad Flat Pack (EQFP)—Wire Bond
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5M40ZE64C4N Details

  • Manufacturer Part Number:

    5M40ZE64C4N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    9 X 9 MM, 0.40 MM PITCH, LEAD FREE, PLASTIC, EQFP-64

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    5

  • Clock Frequency-Max:

    184.1 MHz

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Number of I/O Lines:

    54

  • Number of Inputs:

    54

  • Number of Outputs:

    54

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    85 °C

  • Organization:

    0 DEDICATED INPUTS, 54 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTFQFP

  • Package Equivalence Code:

    TQFP64,.35SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

  • Programmable Logic Type:

    FLASH PLD

  • Propagation Delay:

    7.9 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    1.89 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    7 mm

5M40ZE64C4N Frequently Asked Questions (FAQs)

  • Intel recommends a 4-6 layer PCB stack-up with a minimum of 2 mils (0.05 mm) spacing between layers. A symmetrical stack-up with a central ground plane is recommended for optimal signal integrity.
  • Use the Intel Quartus Prime software to generate a programming file (.sof) and follow the recommended programming flow. Ensure the FPGA is properly powered and clocked before configuration.
  • The 5M40ZE64C4N has a maximum junction temperature of 100°C. Ensure good airflow, use a heat sink if necessary, and follow Intel's thermal design guidelines to prevent overheating.
  • Use the Intel PowerPlay power analysis tool to optimize power consumption. Implement power gating, clock gating, and voltage scaling to reduce power noise and consumption.
  • Follow Intel's EMI and EMC guidelines, use a shielded enclosure, and ensure proper PCB layout and routing to minimize electromagnetic interference and ensure electromagnetic compatibility.

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5M40ZE64C4N Overview

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