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65LBC174AM16DWREP - Texas Instruments

Description: RS-422/RS-485 Interface IC Enhanced Product quad RS-485/RS-422 differential line drivers 16-SOIC -55 to 125

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65LBC174AM16DWREP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DW (R-PDSO-G16)
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65LBC174AM16DWREP - Texas Instruments  - 3D model - Small Outline Packages - DW (R-PDSO-G16)
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65LBC174AM16DWREP Details

  • Manufacturer Part Number:

    65LBC174AM16DWREP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-26

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2019-11-21

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    4

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-422; TIA-422; EIA-485; TIA-485; ISO 8482

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Out Swing-Min:

    0.8 V

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    23 mA

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.25 V

  • Supply Voltage1-Min:

    4.75 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    16 ns

  • Width:

    7.5 mm

65LBC174AM16DWREP Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Decoupling capacitors should be placed close to the device, and signal traces should be kept short and away from noise sources.
  • Use controlled impedance traces, minimize signal reflections, and terminate signals properly. Also, use a common clock and data strobe to ensure data alignment and minimize skew.
  • The device has a thermal pad that must be connected to a solid ground plane for heat dissipation. A thermal interface material can be used to improve heat transfer between the device and the PCB.
  • Power sequencing should be done in a specific order to prevent damage to the device. The recommended sequence is VCC, then VCCQ, and finally VREF. Voltage ramp-up should be done slowly to prevent inrush currents.
  • The device has internal ESD protection, but external protection is still recommended. Use ESD protection devices, such as TVS diodes, and follow proper handling and storage procedures to prevent ESD damage.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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