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66AK2E02ABDA4 - Texas Instruments

Description: IC DSP ARM SOC 1089FCBGA

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PCB Footprints
66AK2E02ABDA4 - Texas Instruments PCB footprint - BGA - BGA - AM5K2E02XABD25
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3D Models
66AK2E02ABDA4 - Texas Instruments  - 3D model - BGA - AM5K2E02XABD25
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66AK2E02ABDA4 Details

  • Manufacturer Part Number:

    66AK2E02ABDA4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    FCBGA-1089

  • Pin Count:

    1089

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Address Bus Width:

    16

  • Boundary Scan:

    YES

  • External Data Bus Width:

    16

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B1089

  • JESD-609 Code:

    e1

  • Length:

    27 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    1089

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    3.55 mm

  • Speed:

    1400 MHz

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    27 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR, RISC

66AK2E02ABDA4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout and thermal design guide in their application notes (e.g., SPRABQ9) and design guides (e.g., TIDA-00628). It's essential to follow these guidelines to ensure optimal performance, thermal management, and signal integrity.
  • Texas Instruments provides detailed documentation and software development kits (SDKs) for each peripheral. Engineers can refer to the device's user guide, peripheral-specific guides, and example code in the SDK to configure and use the peripherals effectively.
  • The 66AK2E02ABDA4 has specific power management and sequencing requirements, which are outlined in the device's datasheet and power management guide (e.g., SPRUGR1). Engineers should carefully follow these guidelines to ensure proper power-up and power-down sequences.
  • Texas Instruments provides various tools and resources, such as the Power Estimation Tool (PET) and the Performance Optimization Guide (POG), to help engineers optimize the device's performance and power consumption for their specific application.
  • The 66AK2E02ABDA4 has specific clocking and reset requirements, which are outlined in the device's datasheet and clocking guide (e.g., SPRUGR2). Engineers should carefully follow these guidelines to ensure proper clocking and reset sequences.

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66AK2E02ABDA4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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