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66AK2G12ABY100 - Texas Instruments

Description: GALILEO FLIPCHIP

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66AK2G12ABY100 - Texas Instruments PCB footprint - BGA - BGA - 66AK2G12ABY100
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66AK2G12ABY100 - Texas Instruments  - 3D model - BGA - 66AK2G12ABY100
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66AK2G12ABY100 Details

  • Manufacturer Part Number:

    66AK2G12ABY100

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.75

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • JESD-30 Code:

    S-PBGA-B625

  • JESD-609 Code:

    e1

  • Length:

    21 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    625

  • Operating Temperature-Max:

    90 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA625,25X25,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.56 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    21 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

66AK2G12ABY100 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also recommended to follow the guidelines in the 'High-Speed PCB Layout Guidelines' application report (SLVA626) for optimal performance.
  • The power supply design should ensure a stable voltage supply to the device. TI recommends using a multi-layer PCB with a solid ground plane, and decoupling capacitors should be placed close to the power pins. A 4-layer PCB with a power plane, ground plane, and two signal layers is recommended.
  • The maximum operating frequency of the 66AK2G12ABY100 is 1.2 GHz, but it can be overclocked to 1.5 GHz with proper cooling and power management.
  • Thermal management is critical for the 66AK2G12ABY100. TI recommends using a heat sink with a thermal interface material, and ensuring good airflow around the device. The thermal design should be validated using thermal simulation tools and thermal testing.
  • The recommended clocking scheme for the 66AK2G12ABY100 is to use a single clock source for all domains, and to use a clock buffer to distribute the clock signal to all parts of the device.

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66AK2G12ABY100 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image X66AK2G12ABY100 Texas Instruments

SoC, CMOS, PBGA625