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66AK2G12ABYA60E - Texas Instruments

Description: Digital Signal Processors & Controllers - DSP, DSC High performance multicore DSP+Arm - 1x Arm A15 cores, 1x C66x DSP core 625-FCBGA -40 to 105

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PCB Footprints
66AK2G12ABYA60E - Texas Instruments PCB footprint - BGA - BGA - ABY0625A_2021
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66AK2G12ABYA60E - Texas Instruments  - 3D model - BGA - ABY0625A_2021
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66AK2G12ABYA60E Details

  • Manufacturer Part Number:

    66AK2G12ABYA60E

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.75

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • JESD-30 Code:

    S-PBGA-B625

  • JESD-609 Code:

    e1

  • Length:

    21 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    625

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA625,25X25,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.56 mm

  • Supply Voltage-Max:

    0.945 V

  • Supply Voltage-Min:

    0.855 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    21 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

66AK2G12ABYA60E Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout and thermal management guide in the '66AK2G12ABYA60E PCB and Thermal Design Guide' document. It's essential to follow these guidelines to ensure optimal performance, reduce thermal issues, and prevent damage to the device.
  • To minimize power consumption, configure the device to use the lowest possible voltage and frequency for your application. Use the Power Management Module (PMM) to control the voltage and frequency scaling. Additionally, use the Low Power Modes (LPM) and Dynamic Voltage and Frequency Scaling (DVFS) to reduce power consumption during idle periods.
  • For high-reliability or safety-critical applications, ensure that you follow the guidelines outlined in the '66AK2G12ABYA60E Reliability and Safety Manual'. This includes implementing error correction mechanisms, using redundant systems, and following strict testing and validation procedures. Additionally, consult with Texas Instruments' support team for guidance on specific requirements and certifications.
  • Use the XDS560v2 emulator or other compatible debug tools to access the device's debug interfaces. Analyze the device's status and error registers to identify the source of the issue. Consult the '66AK2G12ABYA60E Technical Reference Manual' and 'Debug and Troubleshooting Guide' for guidance on specific debugging techniques and error codes.
  • The 66AK2G12ABYA60E is not designed for radiation-hardened or high-temperature environments. For such applications, consider using Texas Instruments' radiation-hardened or high-temperature-rated devices, such as the RAD-Hard or HiRel products. Consult with Texas Instruments' support team for guidance on specific requirements and device selection.

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66AK2G12ABYA60E Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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