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66AK2H12AAAW24 - Texas Instruments

Description: IC DSP ARM SOC 1517BGA

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PCB Footprints
66AK2H12AAAW24 - Texas Instruments PCB footprint - BGA - BGA - AAW (S-PBGA-N1517)-3
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3D Models
66AK2H12AAAW24 - Texas Instruments  - 3D model - BGA - AAW (S-PBGA-N1517)-3
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66AK2H12AAAW24 Details

  • Manufacturer Part Number:

    66AK2H12AAAW24

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    PLASTIC, FCBGA-1517

  • Pin Count:

    1517

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES AT 1200 GHZ

  • Address Bus Width:

    24

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    156.25 MHz

  • External Data Bus Width:

    16

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B1517

  • JESD-609 Code:

    e1

  • Length:

    40 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    1517

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    3.75 mm

  • Speed:

    1400 MHz

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    40 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

66AK2H12AAAW24 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout and thermal management guide in their application notes (SLAU522) and user guides (SPRUHF7). It's essential to follow these guidelines to ensure optimal performance, reduce thermal issues, and prevent damage to the device.
  • The 66AK2H12AAAW24 has a complex power management system. Refer to the device's user guide (SPRUHF7) and power management guide (SLAU523) for detailed information on configuring the power domains, voltage regulators, and power-saving modes to achieve optimal power management.
  • Signal integrity is crucial for high-speed signals. Texas Instruments recommends following the guidelines in their signal integrity application note (SLAU525) for routing high-speed signals, such as DDR3/DDR4, PCIe, and SATA. This includes using controlled impedance, minimizing signal length, and avoiding signal crossing.
  • The boot process and firmware loading can be complex. Refer to the device's user guide (SPRUHF7) and boot loader user guide (SPRUHF8) for detailed information on implementing and verifying the boot process, including configuring the boot modes, loading firmware, and troubleshooting common issues.
  • EMI and EMC are critical considerations for the 66AK2H12AAAW24. Texas Instruments provides guidelines in their EMI and EMC application note (SLAU526) for minimizing EMI and ensuring EMC compliance, including using shielding, filtering, and proper PCB layout techniques.

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66AK2H12AAAW24 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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