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66AK2H12DAAW2 - Texas Instruments

Description: Digital Signal Processors & Controllers - DSP, DSC Multicore DSP+Arm, 4x Arm A15 cores, 8x C66x DSP cores 1517-FCBGA 0 to 85

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66AK2H12DAAW2 - Texas Instruments PCB footprint - BGA - BGA - AAW1517B
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66AK2H12DAAW2 - Texas Instruments  - 3D model - BGA - AAW1517B
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66AK2H12DAAW2 Details

  • Manufacturer Part Number:

    66AK2H12DAAW2

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    5A991.B

  • HTS Code:

    8542.31.00.75

  • Date Of Intro:

    2017-07-27

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • JESD-30 Code:

    S-PBGA-B1517

  • JESD-609 Code:

    e1

  • Length:

    40 mm

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    1517

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    3.62 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    40 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

66AK2H12DAAW2 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout and thermal management guide in the '66AK2H12DAAW2 PCB and Thermal Design Guide' document. It's essential to follow these guidelines to ensure optimal performance, reduce thermal issues, and prevent damage to the device.
  • To minimize power consumption, configure the device to use the lowest possible clock frequency, disable unused peripherals, and use the power-saving features such as dynamic voltage and frequency scaling (DVFS) and low-power modes. Refer to the '66AK2H12DAAW2 Power Management Guide' for more information.
  • For high-reliability or safety-critical applications, consider using the device in a fault-tolerant configuration, implementing error correction mechanisms, and following the guidelines outlined in the '66AK2H12DAAW2 Reliability and Safety Manual'. Additionally, consult with Texas Instruments' support team for specific guidance and recommendations.
  • To ensure EMC and EMI compliance, follow the guidelines outlined in the '66AK2H12DAAW2 EMC and EMI Design Guide'. This includes using proper shielding, filtering, and grounding techniques, as well as minimizing noise generation and susceptibility.
  • The 66AK2H12DAAW2 is rated for operation up to 105°C. However, high temperatures can affect the device's performance, reliability, and lifespan. Consult the '66AK2H12DAAW2 Temperature and Reliability Guide' for specific guidance on thermal management, derating, and reliability considerations.

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66AK2H12DAAW2 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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